Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels there is an extreme need for improved PTH processing. There are several proven routes for high technology flex / flex-rigid manufacturing as well as for high volume applications, but lately there have been some developments. From this presentation, along with suitable ...
Due to reduced investment and running costs, their environmental friendliness and the low space requirements, direct metallization (DM) processes have become very popular in the 1990s. The DM sequences itself can be divided into three subgroups, the conductive polymer based, the Carbon based and the Pd colloid based DM processes. While the latter two at some stage require an etch cleaning step, ...
The increase in environmental awareness globally has also influenced the PCB manufacturing industry. New “green” legislation such as WEEE, RoHS and REACH has been introduced to compel PCB manufacturers to employ less harmful manufacturing chemistries. For the metallization process, this has rekindled interest in direct plating (DP) processes. Explore the environmental benefits of direct plating ...
Introduction PCB manufacturers must permanently contend with difficulties associated with production of PCBs with ever more complex designs, technology requirements and increased lifetime / reli- ability requirements. Issues pertaining to the laminate material used, via sizes, copper layer thickness and electrical requirements, which significantly affect the manufacturing process are often the ...
The process of plating through holes (PTH) is inherent to modern PCB manufacturing. In an arena of increasing circuit density and layer counts, the reliability of the PTH process is under constant microscopic examination. The aim of electroless copper is to plate a conductive layer through a hole or into a blind microvia. In this context an interconnect (IC) refers to the copper to copper adhe- ...
Fast cure adhesives are a great way to reduce assembly costs, but engineers would be wise to question the need for speed when selecting adhesives. In this white paper, Master Bond provides an overview of the different types of fast cure adhesives, including one and two part epoxies, one and two part silicones, cyanoacrylates and UV curables. The strengths and weaknesses of each type of ...
Modern adhesives offer medical device engineers a leg up with new options to simplify fastening and improve performance as medical devices and materials continue to advance. When faced with often hostile environments of human bodies and hospitals, modern, well-designed structural medical adhesive compounds can be used safely for disposable and reusable medical devices. Master Bond’s white paper ...
The demand for flex and flex-rigid boards of ever increasing complexity but at lower costs has never been as high as at present. To be able to compete in such a market requires reliable processes with the capability to handle diverse and emerging materials and designs. This paper will highlight some of the difficulties faced by flex and flex-rigid PCB manufacturers today and will provide working ...
The most commonly known and used metallization technique in PCB manufacturing – electroless copper – will have to meet modern ecological requirements. The main concern is the use of toxic formaldehyde as reducing agent. The Printoganth FF process uses the much more friendly alternative hypophosphite for the reduction of copper ions.
Even though many theoretical and applied investigations have ...
Current methods for the formation of pre-solder bumps for board to board solder joints and in particular for flip chip attachment use stencil printing techniques as part of the process utilising a suitable solder paste. The continuing trend towards increasing miniaturisation and the associated decrease in size of solder resist opening, SRO is causing production difficulties with the stencil ...
Company descriptions and contact
information are quoted
from the company's website or other promotional information. JAZ'D is not responsible for
the accuracy
of this information. Unless specifically noted, JAZ'D is not sponsored by, affiliated with
or otherwise
connected with any of the listed companies.
